±0.002mm Shaft Tolerance
Swiss CNC guide-bushing support helps hold small probe shafts, tip geometry and concentricity for fine-pitch wafer cards and high-density socket contacts.
Custom Semiconductor
Test Probe
Custom machined probe pins, contact bodies and test-socket components to your drawing. Share the contact function, material, finish, assembly features and inspection scope for review.
IATF 16949 & AS9100D quality systems
Material and inspection scope reviewed with your drawing
Prototype and repeat-production enquiries
Finishing and documentation agreed with the order
DFMDrawing & process review
QCAgreed inspection plan
Semiconductor Test Probes: Product Overview
Semiconductor test probes create temporary electrical contact between ATE equipment and wafers, packaged ICs, sockets or power modules during production test and qualification.
The value of a probe is measured by repeatable contact: stable resistance, accurate tip geometry, consistent force, clean plating and predictable life across many touchdowns or insertion cycles.
- ±0.002mm shaft toleranceSwiss CNC machining supports fine shaft control, tip angle accuracy and repeatable guide-plate fit for wafer and socket probe applications.
- Complete probe component rangeVertical wafer pins, cantilever tips, BGA/LGA socket probes, burn-in probes, power probes, RF coaxial probes and probe-card hardware.
- Tungsten and specialty alloy machiningDedicated processes for tungsten, rhenium-tungsten, BeCu, Paliney, Kovar, Invar, stainless steel and semiconductor-grade polymers.
- Cost-effective China productionPrototype and production programs can combine competitive machining cost with optical inspection, XRF plating records and clean packaging.
Why CNCPioneer for Semiconductor Test Probes?
Coordinate geometry, material, finishing and inspection around the part's intended function.
Tungsten Probe Machining
Dedicated tungsten and rhenium-tungsten machining protocols support vertical wafer probe pins, fine tips and high-wear contact components.
±5µm Tip Coplanarity
Controlled probe length and tip geometry help assembled arrays maintain uniform contact force across the full touchdown pattern.
High-Cycle Plating Options
Gold, rhodium, palladium-cobalt and silver plating options are selected by contact resistance, cycle life, temperature and current requirement.
RF Coaxial 50Ω Capability
Controlled center conductors, outer bores and dielectric interfaces support RF probe components with TDR verification when required.
China Cost Advantage
China-based Swiss CNC production helps reduce component cost while keeping optical inspection, plating verification and lot documentation in scope.
What to Include in Your Quote Request
Define the machined component and its role in the probe assembly; component dimensions alone do not validate electrical or lifecycle performance.
- Drawing and model identifying the tip, barrel, shoulder, thread and assembly datums.
- Specified material condition, coating stack, thickness and masked areas.
- Contact, motion and assembly requirements; identify electrical or lifecycle testing separately.
- Quantity, critical dimensions, inspection methods and traceability requirements.
Semiconductor Test Probes We Manufacture
Explore representative configurations and share your drawing for a product-specific review.
Vertical & Cantilever Wafer Probe Pins
Vertical, buckling beam and cantilever probe components for fine-pitch wafer cards, with tungsten, rhenium-tungsten, BeCu and palladium alloy options.
IC Socket Semiconductor Test Probes
BGA, LGA, QFP, flip-chip and CSP socket probe components with controlled plunger geometry, barrel bore accuracy and contact resistance.
Burn-In Socket Semiconductor Test Probes
High-temperature spring-loaded probe components for 125-150°C burn-in, using Paliney, Elgiloy, rhodium plating and thermally stable body materials.
Power Semiconductor Test Probes
Large-diameter force and sense probe components for MOSFET, IGBT, SiC and GaN device test, including low-resistance silver-plated contact designs.
RF Coaxial & GSG Semiconductor Test Probes
Coaxial, GSG and high-speed digital probe components for RF, mmWave and mixed-signal IC test, with impedance-sensitive features controlled by machining.
Probe Card Assembly Components
Guide plates, stiffener plates, space transformer hardware, socket housings and interface components for probe card and ATE socket assemblies.
Industries & Applications
Match the component to its operating environment, assembly interfaces and documentation requirements.
Logic & Memory Device Testing
Fine-pitch probe pins and high-density arrays for wafer sort and final test of logic, DRAM, NAND, SRAM and advanced node devices.
Power Semiconductor Device Testing
Semiconductor Test Probes for process equipment, precision interfaces and test systems, with material and inspection requirements confirmed for the application.
RF & Wireless IC Testing
Semiconductor Test Probes for process equipment, precision interfaces and test systems, with material and inspection requirements confirmed for the application.
Automotive-Grade IC Testing
Probe components for automotive MCUs, ADAS processors, power semiconductors and communication ICs with IATF-compatible documentation.
Advanced Packaging Test
Semiconductor Test Probes for process equipment, precision interfaces and test systems, with material and inspection requirements confirmed for the application.
Burn-In & Reliability Qualification
Semiconductor Test Probes for process equipment, precision interfaces and test systems, with material and inspection requirements confirmed for the application.
Explore machining capabilities, material options and quality support for semiconductor components.
Explore semiconductor machiningMaterials
Materials for Semiconductor Test Probes
Confirm the exact grade, delivery condition and finish compatibility with your drawing.
Tungsten
Drawing-Specified Material
Very hard probe material for wafer pins, cantilever tips and high-cycle applications where tip wear must be minimized.
Tungsten Carbide
Drawing-Specified Material
Wear-resistant option for long-life cantilever tips and contact surfaces in high-touchdown wafer probe applications.
Rhenium-Tungsten
Drawing-Specified Material
Improved ductility versus pure tungsten for fine-pitch vertical probe pins and small-diameter wafer probe designs.
Beryllium Copper
C17200 AT
High-strength spring material for IC socket plungers, burn-in contacts and high-cycle spring probe components.
Paliney 7
Pd-Ag-Cu-Au-Pt-Zn
High-temperature spring alloy for burn-in socket probes where oxidation resistance and force retention matter.
Palladium Alloy
Pd-Co / Pd-Ni
Spring-contact material for moderate-cycle wafer and socket probes where oxidation resistance supports stable contact.
Brass
C3604
Free-machining conductive material for barrels, housings and support components in probe and socket assemblies.
Stainless Steel
17-4PH
High-strength stainless for stiffeners, socket structural hardware and probe assembly components that need rigidity.
Finish selection
Surface Treatments for Semiconductor Test Probes
Select the finish around the specified material, functional surfaces and service conditions. Confirm process details and acceptance requirements with your drawing.
Plating selection
Hard Gold - MIL-G-45204 Class 1
Standard contact finish for IC socket and handler probes where stable resistance, moderate wear life and broad package compatibility are required.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Plating selection
Soft Gold for Wafer Probe Tips
Soft gold helps reduce pad damage on delicate aluminum, copper and bump contacts while maintaining low initial contact resistance.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Finish selection
Rhodium for High-Cycle Probes
Rhodium is used where tip wear and uptime are more important than lowest plating cost, especially in high-volume socket and fixture applications.
- Best for
- Drawing-specific surface requirements
- Specify
- Process, functional surfaces & acceptance
Finish selection
Palladium-Cobalt Plating
Pd-Co provides a middle ground between gold and rhodium for moderate-cycle probes that need better wear life and oxidation resistance.
- Best for
- Drawing-specific surface requirements
- Specify
- Process, functional surfaces & acceptance
Plating selection
Silver Plating for Power Semiconductor Test Probes
Silver supports high-current force contacts where low resistance and reduced heating are critical to accurate power device measurement.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Plating selection
Nickel Underplate & Gold Flash
Nickel underplate helps prevent base-metal diffusion beneath precious metal finishes; gold flash can protect non-contact body surfaces.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Production Capacity
Machining resources for drawing review, prototypes and repeat-production programs.
Swiss CNCPrecision turned components
Mill-turnCombined machining
Inspection & documentation
Quality Control for Semiconductor Test Probes
Review material identity, machining datums, functional dimensions and production records for your component.
IATF 16949AS9100D
To drawingCritical dimensions
As agreedInspection scope
Final tolerances, inspection coverage and acceptance criteria are confirmed against your drawing, material and geometry.
Material Verification
- Check
- Specified grade, material condition and lot identity.
- Verify
- Material certificates and agreed identification checks.
- Records
- Material certificates and required traceability records.
Machining Process Control
- Check
- Contact geometry, mating diameters and plating allowance.
- Verify
- Drawing datums, setup planning and in-process inspection.
- Records
- Agreed critical-feature and process inspection records.
Dimensional Inspection
- Check
- Functional dimensions, mating features and surface condition.
- Verify
- Suitable measuring equipment and drawing-specific gauges.
- Records
- Dimensional reports and specified finish results.
Production Documentation
- Check
- First-piece approval, production records and delivery requirements.
- Verify
- The inspection plan and customer approval process.
- Records
- Agreed document pack, including PPAP or FAIR when required.
Agree Your Quality Document Pack
Confirm the certificates, inspection reports and production records needed for your order when sharing your drawing.
Semiconductor Test Probes FAQ
Which Semiconductor Test Probes designs can you manufacture?
The product range includes Vertical & Cantilever Wafer Probe Pins, IC Socket Semiconductor Test Probes, Burn-In Socket Semiconductor Test Probes. Custom geometry is reviewed against the approved drawing.
- Include the mating interfaces, critical datums and expected order quantity.
Which materials can I specify?
Material options include Drawing-Specified Material, Drawing-Specified Material, Drawing-Specified Material. The exact grade and condition should be confirmed for your application.
- Include material certificate, finish and any restricted-substance requirements with your enquiry.
What should I include in the drawing?
Define contact geometry, mating diameters and plating allowance, together with datums, tolerances and required surface condition.
- Include a 2D drawing and 3D model where available.
- Identify the dimensions that affect assembly or function.
What finishing and inspection records can be requested?
Finishing options include hard gold - mil-g-45204 class 1, soft gold for wafer probe tips, rhodium for high-cycle probes. Applicability is reviewed against the specified material and geometry.
- Agree material certificates, dimensional reports and any PPAP or FAIR requirements with the order.
How are pricing and lead time confirmed?
Pricing and delivery are confirmed after reviewing the drawing, material availability, quantity, machining route, finishing and inspection scope.
- Prototype and repeat-production schedules are quoted for the specific order.
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Get a Quote for Semiconductor Test Probes
Share your drawing or 3D model, material, critical dimensions, finish and order quantity. We’ll review the machining route, inspection scope and delivery requirements.
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