Semiconductor

Micron-level precision accelerates semiconductor device innovation—delivery in as little as 1-3 days, tolerances starting from ±0.001mm, supporting vacuum compatibility and low particle release.

How Do You Use Our Machining Services

Rapid Prototype Iteration

1-3 day turnaround with free DFM optimization. Validate complex geometries and functionality quickly to accelerate development cycles.
📦

Low-Volume Bridge Production

No MOQ requirements, ideal for 10-1,000 piece runs. Quickly respond to equipment upgrades and replacement part demands.
🎯

High-Precision Integrated Forming

Turn-mill complex machining in one setup, avoiding multiple fixtures. Enhances coaxiality and surface quality for critical components.
🌡️

Clean Environment Support

Low particulate emission materials and specialized packaging. Suitable for vacuum chambers, wafer handling systems, and cleanroom applications.

High-Precision CNC Machining On-Demand

Swiss Machining

Swiss machining: ultra-precise, small-diameter complex parts machined from bar stock in a single setup – with micron-level tolerances and zero secondary operations.

CNC Turning and Milling

CNC turning with live tooling combines both lathe and mill capabilities to machine parts with cylindrical features from metal rod stock.

Quality Assurance Measures

📐

CMM Three-Coordinate Inspection Report

Utilize high-precision three-coordinate measuring machines for comprehensive product inspection, ensuring each dimension meets design requirements and providing detailed inspection data reports.

📋

First Article Inspection (FAI) Report

Conduct comprehensive First Article Inspection (FAI) on the first product of batch production to verify the stability of the production process and prevent batch quality issues.

📄

Material Certificates + Cleanliness Certification

All raw materials come with formal material certificates and pass strict cleanliness testing to ensure safe use of products in high-demand environments.

🔬

Surface Roughness/Particle Release Testing

Use professional equipment to test product surface roughness and particle release, meeting high-standard cleanliness requirements of medical, electronic and other industries.

Recommended Materials & Surface Finishes

Semiconductor Equipment Material Solutions - Optimized for Performance & Precision

Lightweight
Al

Aluminum Alloy

6061 / 7075 Series

Lightweight chambers, support frames, structural components with excellent strength-to-weight ratio for semiconductor equipment.

High Vacuum
Ti

Titanium Alloy

Ti6Al4V Grade 5

High-strength, low outgassing vacuum components, chamber internals, and structural supports for ultra-high vacuum systems.

Thermal Management
Cu

Copper / OFC

C101 / C102

Heat spreaders, cooling channels, thermal management systems with exceptional thermal conductivity for heat dissipation.

Dimensionally Stable
Fe-Ni

Invar / Kovar

Fe-Ni Alloys

Precision positioning fixtures, optical mounts, dimensionally stable parts with extremely low thermal expansion coefficients.

Specialized Surface Finishes

Mirror Polishing
Chemical Passivation
Electropolishing
PVD Coating
Low-Particle Finish
Ultrasonic Cleaning
Vacuum Baking
Plasma Treatment

High-Precision Semiconductor CNC Machining Parts Made

Rapid, cost-effective high-precision CNC prototypes & low-volume production for semiconductor .

Additional Resources

Questions?

Our experts are here for you!.