Swiss CNC Miniature Precision
Swiss CNC lathes machine probe pin tip diameters as small as Ø0.1mm with tip geometry accuracy ±0.005mm .
Custom Test
Probe Pins
Custom Test Probe Pins Precision Machining made to your drawing. Review contact geometry, mating diameters and plating allowance, material, finishing and inspection requirements before production.
IATF 16949 & AS9100D quality systems
Material and inspection scope reviewed with your drawing
Prototype and repeat-production enquiries
Finishing and documentation agreed with the order
DFMDrawing & process review
QCAgreed inspection plan
Test Probe Pins
Test probe pins are precision-machined electrical contact components used in automated test equipment (ATE), in-circuit test (ICT) fixtures, functional test systems, wafer probe cards, and burn-in sockets to establish temporary electrical contact with semiconductor devices, printed circuit boards, and electronic assemblies during manufacturing test and quality inspection.
- Swiss CNC tip precisionTip diameters as small as Ø0.1mm with tip geometry accuracy ±0.005mm and concentricity ±0.003mm — covering fine-pitch wafer probe pins through large-diameter ICT pogo pin plungers.
- All tip geometry typesCrown, spear, serrated, flat, concave, chisel, needle, bullet, knife, GSG — dedicated machining protocols for every probe pin tip configuration across semiconductor and electronics test applications.
- Precious metal platingReview contact geometry, mating diameters and plating allowance and functional requirements before defining the process.
- Finished Contact Dimension ReviewSpecify the tip geometry, mating diameters and plating allowances so finished probe dimensions can be inspected against the component drawing.
Why CNCPioneer for Test Probe Pins?
Coordinate geometry, material, finishing and inspection around the part's intended function.
All Tip Geometry Types
Review contact geometry, mating diameters and plating allowance and functional requirements before defining the process.
Precious Metal Plating
Contact tip surface finish Ra 0.2μm ensures uniform gold, rhodium, palladium, and nickel plating distribution .
Finished Contact Dimension Review
Specify the tip geometry, mating diameters and plating allowances so finished probe dimensions can be inspected against the component drawing.
High-Volume Wholesale Capacity
Review geometry, batch quantity and process requirements to prepare the quotation.
Functional Geometry Review
Review contact geometry, mating diameters and plating allowance before choosing the machining and inspection route.
Test Probe Pins We Manufacture
Explore representative configurations and share your drawing for a product-specific review.
Pogo Pin Test Probes
Complete pogo pin assemblies — plunger, barrel, and spring — for PCB ICT, functional test, and burn-in socket applications.
Wafer Probe Card Pins
Vertical and cantilever wafer probe card pins for semiconductor die bond pad contact at 28nm–5nm technology nodes.
ICT & Functional Test Probe Pins
Crown, spear, serrated, flat, concave, and chisel tip probe pins for PCB in-circuit test and functional test fixtures.
Burn-In Socket Probe Pins
High-temperature probe pins for BGA, LGA, QFP, and SOP device burn-in socket contact at 125–150°C.
RF & High-Frequency Test Probe Pins
Coaxial probe pin assemblies (50Ω and 75Ω) for RF test applications to 40 GHz+, and GSG (ground-signal-ground) probe tip components for on-wafer RF device characterization in VNA measurement applications.
Custom & OEM Test Probe Pins
Proprietary probe pin designs for novel probe card architectures, custom burn-in socket designs, and specialty test fixture applications — including non-standard diameters, lengths, tip geometries, and plating configurations.
Industries & Applications
Custom test probe pins for semiconductor devices and electronic assemblies. Select pin geometry, materials and plating around the test point, fixture layout and inspection requirements.
Semiconductor Test
Custom probe pin components for wafer probe cards, packaged-device test sockets and burn-in assemblies. Specify contact pitch, tip geometry, material and plating to match the test interface and assembly drawing.
Explore semiconductor machining
Automotive Electronics Test
Test probe pins for ECU boards, ADAS sensor modules, power electronics and battery management systems. Define pad access, contact geometry and fixture alignment for continuity checks and functional testing during production.
Explore automotive machining
Consumer Electronics Test
Custom contact pins and probe tips for smartphone, wearable and other consumer electronics test fixtures. Match tip profiles, test-point spacing and plating to PCB pads, connectors and repeated contact during production tests.
Explore electronics machining
Medical Electronics Test
Probe pin components for production testing of patient monitors, diagnostic instruments and medical electronics. Specify contact geometry, material traceability and handling requirements for circuit-board, connector and functional test fixtures.
Explore medical machining
Server & Networking Test
Probe pins and replaceable contact components for server motherboard, power supply and networking equipment test fixtures. Match contact spacing, connector access and pin geometry to board-level inspection and functional test requirements.
Explore server machining
Aerospace Electronics Test
Custom probe pin components for ground testing of avionics boards, instrument modules and electrical connectors. Specify contact tips, fixture alignment and inspection records around the test interface and supplied drawing.
Explore aerospace machiningMaterials
Materials for Test Probe Pins
Confirm the exact grade, delivery condition and finish compatibility with your drawing.
Beryllium Copper
C17200 AT (Age-Tempered)
Highest strength copper alloy · Excellent spring properties · Good conductivity · Pogo pin plungers, high-cycle ICT probes, burn-in socket pins
Beryllium Copper
C17500 (High Conductivity)
Higher conductivity BeCu · Good spring properties · High-conductivity pogo pin applications where current-carrying capacity is a priority
Brass
C3604 Free-Machining Brass
Excellent machinability · Good conductivity · Cost-effective · High-volume ICT probe pin barrels, low-cost pogo pin components
Phosphor Bronze
C51000 Phosphor Bronze
Good spring properties · Excellent corrosion resistance · Solderable · General ICT probe pins, moderate-cycle applications
Tungsten
Tungsten W / W-Ni-Fe
Extreme hardness · High wear resistance · Wear-resistant wafer probe tips, high-cycle-count probe card cantilever pins
Tungsten Carbide
WC-Co Tungsten Carbide
Maximum hardness · Minimum tip wear · Long-life wafer probe card cantilever pins at advanced semiconductor technology nodes
Specialty Alloy
Paliney 7 (Pd-Ag-Au-Pt)
Excellent high-temperature spring properties · Oxidation resistant · Burn-in socket probe pins, high-temperature test applications to 150°C
Specialty
Kovar (ASTM F15)
Matched thermal expansion with ceramic packages · Hermetic package test socket components and precision ceramic-matched fixtures
Finish selection
Surface Treatments for Test Probe Pins
Select the finish around the specified material, functional surfaces and service conditions. Confirm process details and acceptance requirements with your drawing.
Plating selection
Hard Gold Plating
The most widely used test probe pin plating for ICT, functional test, and burn-in socket applications.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Finish selection
Rhodium Plating
Extremely hard (HV 800–1000), oxidation-resistant plating for ultra-high contact cycle applications exceeding one million cycles.
- Best for
- Drawing-specific surface requirements
- Specify
- Process, functional surfaces & acceptance
Finish selection
Palladium-Cobalt Plating
Higher hardness than pure palladium with excellent wear resistance and stable contact resistance.
- Best for
- Drawing-specific surface requirements
- Specify
- Process, functional surfaces & acceptance
Plating selection
Soft Gold Plating (Wafer Probe)
Pure gold (99.9% Au, HV 60–80) plating for wafer probe card pin applications requiring maximum contact compliance and minimum contact resistance on delicate aluminum or copper bond pads.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Plating selection
Nickel Plating (Underplate & Standalone)
Applied as a diffusion barrier underplate beneath gold, rhodium, and palladium on test probe pin contact surfaces to prevent base metal diffusion into the precious metal layer.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Plating selection
Silver Plating
High electrical conductivity silver plating for high-current test probe pin applications including power device test and battery contact probe pins where maximum current-carrying capacity is the primary performance requirement.
- Best for
- Contact, appearance or barrier requirements
- Specify
- Coating stack, thickness & masking
Production Capacity
Machining resources for drawing review, prototypes and repeat-production programs.
Swiss CNCPrecision turned components
Mill-turnCombined machining
Inspection & documentation
Quality Control for Test Probe Pins
Review material identity, machining datums, functional dimensions and production records for your component.
IATF 16949AS9100D
To drawingCritical dimensions
As agreedInspection scope
Final tolerances, inspection coverage and acceptance criteria are confirmed against your drawing, material and geometry.
Material Verification
- Check
- Specified grade, material condition and lot identity.
- Verify
- Material certificates and agreed identification checks.
- Records
- Material certificates and required traceability records.
Machining Process Control
- Check
- Contact geometry, mating diameters and plating allowance.
- Verify
- Drawing datums, setup planning and in-process inspection.
- Records
- Agreed critical-feature and process inspection records.
Dimensional Inspection
- Check
- Functional dimensions, mating features and surface condition.
- Verify
- Suitable measuring equipment and drawing-specific gauges.
- Records
- Dimensional reports and specified finish results.
Production Documentation
- Check
- First-piece approval, production records and delivery requirements.
- Verify
- The inspection plan and customer approval process.
- Records
- Agreed document pack, including PPAP or FAIR when required.
Agree Your Quality Document Pack
Confirm the certificates, inspection reports and production records needed for your order when sharing your drawing.
Test Probe Pins FAQ
Which Test Probe Pins Precision Machining designs can you manufacture?
The product range includes Pogo Pin Test Probes, Wafer Probe Card Pins, ICT & Functional Test Probe Pins. Custom geometry is reviewed against the approved drawing.
- Include the mating interfaces, critical datums and expected order quantity.
Which materials can I specify?
Material options include C17200 AT (Age-Tempered), C17500 (High Conductivity), C3604 Free-Machining Brass. The exact grade and condition should be confirmed for your application.
- Include material certificate, finish and any restricted-substance requirements with your enquiry.
What should I include in the drawing?
Define contact geometry, mating diameters and plating allowance, together with datums, tolerances and required surface condition.
- Include a 2D drawing and 3D model where available.
- Identify the dimensions that affect assembly or function.
What finishing and inspection records can be requested?
Finishing options include hard gold plating, rhodium plating, palladium-cobalt plating. Applicability is reviewed against the specified material and geometry.
- Agree material certificates, dimensional reports and any PPAP or FAIR requirements with the order.
How are pricing and lead time confirmed?
Pricing and delivery are confirmed after reviewing the drawing, material availability, quantity, machining route, finishing and inspection scope.
- Prototype and repeat-production schedules are quoted for the specific order.
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Get a Quote for Test Probe Pins
Share your drawing or 3D model, material, critical dimensions, finish and order quantity. We’ll review the machining route, inspection scope and delivery requirements.
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